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MF388 High Performance LED DS5468 ISSUE 1 May 2001 Ordering Information MF388 MF388 ST 12940.11 TO-46 Package 13208.11 ST Housing Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less Description This device is designed for Ethernet 100 Mbps and Intra-Office Telecom applications and offers an excellent price/performance ratio for cost effective solutions. Its double-lens optical system results in optimum coupling of power into the fiber. TO-46 Package with Lens Optical and Electrical Characteristics - Case Temperature 25C Parameter Fiber-Coupled Power (Fig. 1,2 & 3) (Table 1) Rise and Fall Time (10-90%) Bandwidth (3dBel) Peak Wavelength Spectral Width (FWHM) Forward Voltage (Fig. 5) Reverse Current Capacitance Symbol Pfiber tr'tf fc p VF IR C 20 200 250 Min. 40 Typ. 50 2 Max. Unit W ns MHz Test Condition IF=50mA (Note 1) IF=50mA (no bias) IF=50mA IF=50mA IF=50mA IF=50mA VR=1V VR=0V, f=1MHz Fiber: 62.5/ 125m Graded Index NA=0.275 800 820 840 60 1.85 20 nm nm V A pF Note 1: Measured at the exit of 100 meters of fiber O4.7 O1.5 0.6 CASE 3.7 14 2.5 5.4 BOTTOM VIEW 0.4 The diode chip is isolated from the case All dimensions in mm 1 ANODE CATHODE MF388 Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature see (derating: Fig. 4) Electrical Power Dissipation (derating: Fig. 4) Continuous Forward Current (f<10kHz) Peak Forward Current (duty cycle<50%, f>1MHz) Reverse Voltage Soldering Temperature (2mm from the case for 10sec) Symbol Tstg Top Ptot IF IFRM VR Tsld Limit -55 to +125C -40 to +85C 250 mW 110 mA 180 mA 1.5V 260C Thermal Characteristics Parameter Thermal Resistance-Infinite Heat Sink Thermal Resistance-No Heat Sink Temperature Coefficient - Optical Power Temperature Coefficient - Wavelength Symbol Rthjc Rthja dP/dTj d/dTj -0.6 0.3 Min. Typ. Max. 100 400 Unit C/W C/W %/C nm/C Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numberical Aperture 50/125 m 0.20 20W 62.5/125 m 0.275 50W 100/140 m 0.29 100W 200/230 m 0.37 140W 2 MF388 % 100 % 100 r RELATIVE FIBER-COUPLED POWER RELATIVE FIBER-COUPLED POWER Oc = 62.5Em 80 80 z 60 60 40 40 r 20 c Em 20 0 0.5 2.0 3.0 mm 0 0 20 40 60 80 100 m z - AXIAL DISPLACEMENT OF FIBER r Figure 1 % 100 Figure 2 mW 300 80 50% DUTY CYCLE MAX. ELECTRICAL POWER DISSIPATION RELATIVE FIBER-COUPLED POWER 200 60 DC INFINITE HEAT SINK NO HEAT SINK 40 100 20 HEAT SINKED 0 0 40 80 120 160 200 mA 0 0 50 100 150C FORWARD CURRENT OPERATING TEMPERATURE Figure 3 mA 200 Figure 4 FORWARD CURRENT 100 0 0 1 2 3V FORWARD VOLTAGE Figure 5 3 BOTTOM VIEW ( 10 : 1 ) 3,8 2,54 0,6 n1,17 + 0,05 (3x) n0,45 + 0,03 (3x) - SIDE VIEW 13,460,76 0 0,04 45 R2,7 R0,2 max (4x) 3, 6 1, 0 2 0, 3 Lens n1.50.05 R0,4 max NOTES:1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 m. Header: Ni 2-3 m / Au min 1,32 m. n4,7 0,3 max glass overmould (2x) (c) Zarlink Semiconductor 2002. All rights reserved. Package code Previous package codes Drawing type ISSUE ACN DATE 1 JS004 076R1 A TB Package drawing, TO-46 with lens Title 22-MAR-03 APPRD. TD/BE JS004076 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request. Purchase of Zarlink's I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE |
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